Product Testing

Assembly Testing

RiverSide Integrated Solutions provides full circuit board and electromechanical assembly testing capabilities – including testability recommendations, test development, and test execution. We perform circuit board assembly testing, system-level integration testing, and thermal and mechanical stress testing depending on product requirements. We use assembly testing to confirm product quality and functionality to provide a means of monitoring the critical stages of our manufacturing process.

Assembly Testing RiverSide Integrated Solutions

Circuit Board Assembly Testing

With our circuit board services, you can always expect thorough assembly testing including:

  • Flying probe: The flying probe test method is highly-effective for low-volume to mid-volume production, as well as prototypes and boards that can pose access difficulties.
  • In-circuit test: With an incorporated functional in-circuit test software and in-system component programming, we are able to probe printed circuit boards to examine shorts, opens, resistance, capacitance, and other detailed information about the assembly.
  • Manufacturing defect analyzer: As a secondary in-circuit test, the MDA operates as a diagnostics tool to reveal any defects in manufacturing and components.
  • Functional test: Designed and built in-house, our functional test software assesses the functionality of an application, basing results and case information on the software component of an assembly. Our test system capabilities include C++ programming and Visual Basic.
  • Burn-in chambers: With temperature and humidity cycling, environmental stress screening, and product life assessment, our burn-in chambers place assemblies into service simulation that forces failures to occur. This test reveals weaknesses and load capacities and is especially effective in evaluating the reliability of high-density semiconductor devices, burn-in printed circuit boards and large capacity screenings.
  • Automated optical inspection: Our AOI machines test boards and panels to communicate errors quickly, consistently, and accurately to the operator.
  • Flying probe: The flying probe test method is highly-effective for low-volume to mid-volume production, as well as prototypes and boards that can pose access difficulties.

Test Solutions

  • Automated Optical Inspection- YesTech YTV-FS
  • Flying Probe – SPEA
  • In-Circuit Test – Agilent 3070; Checksum
  • Functional Test, ESS and Burn-In
  • Custom Functional Test (software & hardware development)
  • RiverSide functional test platform
  • Environmental Stress Screening – Thermotron ovens
  • Temperature and humidity cycling (-40C to +85C)
  • LN2 boost cooling capability-GN2 chamber drying/moisture purging