What is the Next Big Trend in PCBA?

According to a recent report, the printed circuit board assembly (PCBA) market is expected to grow by 4.12% from 2020 to 2025. This represents an excellent growth opportunity for the PCBA and PCBA sectors.

The industry must be responsive to capitalize on this growth as technologies emerge and evolve. There have been many technological advancements in the printed circuit board (PCB) sector in recent years. As such, there are several key trends that original equipment manufacturers (OEMs) must monitor.

Since the PCB and PCBA sectors are intertwined, trends within the PCB industry also directly impact the PCBA sector. Below are some of the next big trends in the PCB world.

PCBs continue to shrink in size but grow in capability as demand grows for more portability and higher functionality. This includes hand-held and wearable devices for consumer and commercial markets.

High-density circuitry is a fantastic advancement that has enabled smaller, more tightly packed boards for these devices. OEMs must keep up with the rapid advancements and be able to assemble smaller panels with more compact components.

Traditional PCBs are rigid and inflexible. One of the recent trends is toward more flexible PCBs. These are categorized as flex, which has more bend and can withstand more movement than traditional rigid PCBs.

There is also a category of rigid-flex, a hybrid option offering the best attributes of rigid and flex technologies. Rigid-flex PCBs typically contain flexible layers attached to one or more rigid boards.

To remain competitive, PCBA providers must broaden their expertise to include flexible, rigid and rigid-flex PCB arrangements.

In recent years, many companies have been seeking innovative solutions to improve the sustainability of their processes and products. The EPA defines sustainable manufacturing as “products . . . that minimize negative environmental impacts while conserving energy and resources.”

These sectors seek opportunities to reduce or eliminate pollutants and decrease their carbon footprint. Some solutions include lead-free soldering and biodegradable boards.

There are many benefits to pursuing more environmentally friendly operations. Some common methods include waste reduction, efficiency gains, improved brand reputation and meeting new regulations. All of these things provide a more competitive edge.

To deliver high-quality assemblies with rapid speed to market, PCBA providers are relying more heavily on process automation technologies. The additional automation provides productivity and speed benefits. It also reduces labor costs and the risk of error during assembly operations.

Automation and robotics also allow for easier customization. With automated systems, modifications to design can be made by simply altering the software input.

PCB assembly is becoming more complex as pressure increases to deliver high-quality PCBs faster. This change has pushed many OEMs to outsource their PCBA processes to contract manufacturers.

Of course, when selecting a contract manufacturer to outsource to, OEMs must be diligent in selecting one that employs advanced assembly technologies. That’s why so many turn to companies like RiverSide Integrated Solutions (RIS). We focus on meeting the challenges of the trends above.

At RIS, PCB assembly is one of our core competencies. We provide reliable, seamlessly-assembled printed circuit board systems built with extreme precision.

Our skilled engineers, technicians and assemblers work to put together a complete PCBA expertly. When you choose RIS, you can expect the hands-on customer care of a small operation with the capabilities characteristic of a larger company. We provide our complete electronics manufacturing services for OEMs in any industry.

Our electronics assembly expertise includes:

• Surface Mount Technology (Fine-pitch, BGA (1 mm), µBGA (.4 mm), 01005, X-Ray, automated rework, and automated optical inspection (AOI)
• Magazine to Magazine handling
• Smart Shelving floor stock inventory control
• X-ray reel counting
• Lead-through auto-insertion (Axial, Radial, DIP, and Zierick Terminals)
• Wave Solder and Selective Solder Machines (No-clean & aqueous flux processes) RoHS and Tin/Lead capabilities
• Special Application Equipment (Cobot dispensing systems)
• Conformal coating (Silicone, Urethane)
• Potting (Epoxy, Urethane, and Silicone)
• Low-pressure molding technology
• Comprehensive product testing
• 3D Printing